Ultra-thin, DSEK/DSAEK endothelium inserting device, for lenticle thickness, below < 180 micron. Both models can be disassembled for proper post-op cleaning and maintenance. 3.5 mm incision
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P.IVA/C.F./Reg.Imp.Como IT 01557980131 - Capitale sociale € 93.600 int.versati - Cookie Policy
